Brosis Industry Co.,Limited

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Brosis Industry Co.,Limited

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high frequency bonding ic pcb
Specification: Material: FR4
Detail: Thickness: 1.6mm, copper foil: h/h oz Surface Treatment: Green Sloder Mask, Gold Plating Parameter: Min width/gap 0.1/0.1mm, Min drill size: 0.4mm, Via holes in bonding IC area be Plugged

high frequency teflon pcb
Specification: Material: Teflon resin
Detail: Thickness: 0.8mm, copper foil: h/h oz Surface Treatment: LPI Green, HASLLead free Parameter: Min width/gap 0.15/0.15mm, Min drill size: 0.25mm

hasl lead free pcb
Specification: Material: FR4
Detail: Thickness: 1.6mm, copper foil: h/h oz Surface Treatment: LPI Green, Lead free Parameter: Min width/gap 0.15/0.076mm, Min drill size: 0.3mm

double sided osp board
Specification: Material: FR4
Detail: Thickness: 1.6mm, copper foil: h/h oz Surface Treatment: Green solder mask, OSP Parameter: Min width/gap 0.1/0.1mm, Min drill size: 0.3mm

pcb for telphone
Specification: Material: FR4
Detail: Thickness: 1.6mm, copper foil: h/h oz Surface Treatment: LPI Green, Gold Plating Parameter: Min width/gap 0.15/0.15mm, Min drill size: 0.3mm

double side osp pcb
Specification: Double Side
Detail: Double Sided OSP PCB


Showing 1 - 7 of 7, total 1 pages [First] [Previous] [Next] [Last]
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